SMTC Glossary of Terms

A B C D E F I L M N P S T V X
Scanning Electron Microscopy is a scanning method, which utilizes a microscope with 200 times magnification or greater.
Semiconductors are materials whose properties fall between those of insulators and conductors, and is also the term used for all electronic components made from semiconductor material. Semiconductors, most commonly silicon and germanium, are the basic foundation of nearly all solid-state electronic devices.
Small-Outline J-lead (SOJ) is a type of chip module, which utilizes inward extending J-shaped pins to attach chips to a printed circuit board surface.
Static Random Access Memory (SRAM) is a type of non-volatile memory commonly used in caching, which is faster (and more expensive) than dram because it does not require refreshing.
Supply Chain Management (SCM) is the management of a portfolio of assets (human, equipment, components, etc.) and relationships (customers, suppliers, staff, etc.) to transform a customers product from raw material to finished product as efficiently as possible.
Surface Mount Technology (SMT) is the principal technology for the assembly of printed circuit boards by soldering electrical components directly to a board substrate that uses less space than the pin-through-hole method. SMT is a highly flexible technology that can be continually reconfigured to meet customer-specific product requirements. Each SMT assembly line is designed to have PCB screen printing, component placement and solder reflow capabilities.
Synchronous Dynamic Random Access Memory (SDRAM) is a relatively new type of dram, which synchronizes itself with the CPUÔÇÖs bus and is capable of running at higher clock speeds than conventional memory.
System Design and Engineering is a series of processes for taking an electrical product from customer-supplied requirements to volume production, with focuses on functionality, cost, size, manufacturability, scalability, compatibility, durability, safety and serviceability. The process includes hardware design, product architecture, circuit design and schematic capture, technology assessment and selection, component selection, parts sourcing and production quantity ordering, printed circuit board layout, mechanical design, software development, concurrent and sustaining engineering, sub-assembly integration and interconnection, enclosure and packaging design, functional and environmental compliance and prototyping, as well as programmable device software development and other services.