SMTC Glossary of Terms

A B C D E F I L M N P S T V X
Flash is a densely packable, relatively inexpensive type of nonvolatile memory, which can be modified electrically, often while in a circuit. Flash architecture generally assumes that it will be read often but seldom written to.
Flex Circuit Assembly is an advanced process of attaching electrical components to a flexible circuit. Flex circuits are utilized in compact devices with mobile mechanical assemblies such as wireless devices and data storage systems.
Flip Chips are structures that house circuits interconnected face down directly to the substrate with solder bumpers without leads, and are utilized to minimize printed circuit board surface area when compact packaging is required.
Full System Build , also called systems assembly and test, is the process of building and integrating from components and subassemblies (populated PCBs, power supplies, cables, enclosures, etc.), and then testing the finished product, which may also involve loading software and optional configuration.
Functional Testing is a high speed method of testing electronic products by simulating actual use modes in high-volume.